HiredNow AI
Ensurge Micropower

Senior Manufacturing Engineer – Thin Film Engineering (PVD, PECVD, ALD & RIE)

$162,000 to $198,000 a year

  • San Jose, California
  • Full time

Found by HiredNow AI on Jul 22, 2026. Subscribers saw it first.

About the role

About Ensurge Micropower

Ensurge Micropower (OSE: ENSU) is a pioneer in solid-state microbattery technology,
enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for
wearables, health tech, industrial sensing, and defense applications. As our technology
transitions from development to production, disciplined manufacturing execution becomes the
differentiator.

Role Overview
Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film
Engineering processes — deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) — from
pilot through early production. This role is not just about process — it is about delivering
manufacturing results.

Responsibilities

  • Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE process areas
  • Drive output, yield, uptime, and cycle time
  • Support production directly — troubleshooting issues in real time
  • Partner with Operations to ensure line execution meets plan
  • Convert R&D processes into repeatable, production-ready workflows

Define and lock critical process parameters (CPPs) — e.g., chamber pressure, Ar/process
gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness
uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle
count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas
chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias,
and endpoint detection (RIE)

Define and lock control limits and OCAPs

Ensure processes are robust, stable, and scalable
Work with Equipment Engineering to:

Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and
precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems,
RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems)

Improve reliability and uptime

Implement process-driven upgrades

Lead tool qualification and process acceptance

Ensure equipment supports throughput, precision, and repeatability
Own flow from substrate input → deposition/etch → downstream handoff to assembly

Reduce bottlenecks, WIP, and inefficiencies

Improve line balance and production scheduling alignment

Support layout and flow improvements as the system scales
Partner with Quality to implement:

  • SPC and process control on film thickness, stress, uniformity, and conformality
  • Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs

Traceability and data capture Build and maintain:

SOPs

Process specs

Control plans

Ensure manufacturing is data-driven and auditable
Lead structured RCA on:

Yield loss

Defects

Downtime

  • Use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions
  • Implement sustainable fixes — not workarounds
  • Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.) Qualifications Required

7–12+ years in manufacturing engineering with thin-film deposition and etch
(PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film
industries

Proven experience owning manufacturing processes on the floor

Strong track record of driving yield and throughput improvements

Experience supporting or leading pilot → production scale-up

Hands-on mindset — comfortable working directly with equipment, technicians, and operators

Working knowledge of thin-film characterization techniques (e.g., ellipsometry,
profilometry, XRD, SEM) and their use in validating and controlling deposition processes
Preferred

Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias

Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection (RIE/ICP-RIE)

Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing

Vacuum systems and chamber conditioning experience

Experience with image-based film/defect characterization (SEM, optical microscopy) and
correlating characterization data back to process control limits

Experience with MES, traceability systems, or data-driven manufacturing
Salary Range:
$162,000-$198,000
The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.

Apply at Ensurge Micropower