About the role
Location
Alhambra, CA
Position Summary
The Backend Process Engineer –
InP
Wafer Fab position
is responsible for
development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (
InP
)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA),
and
automated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.
Responsibilities
:
Backend Process Ownership and Optimization (35%)
:
Own and
- optimize
- backend wafer
- fab
- processes including lapping/thinning, n-side metallization, and RTA
- Establish robust process windows, recipes, and control limits for backend modules
- Maintain stable manufacturing performance through continuous monitoring and improvement
Yield Improvement, Defect Reduction, and AOI Control (25%)
:
- Own and maintain AOI processes for backend defect detection and yield monitoring
- Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations
- Analyze inline and post-process data to
- identify
- trends and systematic issues
- Implement corrective and preventive actions and verify effectiveness
- Singulation,
Optical
Coatings, and Packaging Interface Support (20%)
:
- Support cleaving, dicing, and singulation processes to ensure device integrity
- Provide process engineering support for AR/HR optical coatings and vendor qualifications
- Collaborate with packaging, device, and reliability teams to ensure packaging readiness
New Product Introduction and Technology Support (10%)
:
- Support new product introduction (NPI), process transfers, and technology changes
- Evaluate backend process risks associated with
- new designs , materials, and device structures
Documentation, Process Control, and Manufacturing Support (10%)
Author and
- maintain
- SOPs, travelers, process specifications, and control plans
- Define SPC metrics and control strategies for backend processes
- Provide hands-on manufacturing and troubleshooting support as needed
Minimum Qualifications
:
- Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field
- Minimum of 3+ years of experience in
- backend semiconductor processing
- Hands-on experience with lapping/thinning, metallization, and thermal processes
- U nderstanding of
InP
-based or III-V compound semiconductor wafer fabrication processes
Experience with AOI systems, yield analysis, and data-driven process improvement
Strong understanding of singulation, packaging interfaces, and reliability requirements
Proficiency
in SPC, DOE, and statistical analysis
Ability to work across cross-functional manufacturing and engineering teams
Preferred experience with
InP
- or III-V optoelectronic devices
- Familiarity with AR/HR optical coating processes
- Experience supporting high-mix, low-volume manufacturing environments preferred
- The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may
- be required
- to perform job-related tasks other than those specifically included in this description.
- All duties and responsibilities are essential
- job
- functions and requirements and are subject to
- possible modification
- to
- reasonably accommodate
- individuals with disabilities.
- A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration in
- determining
- base salary, including but not limited to: job-related qualifications, skills,
- education
- and experience, as well as job location and the value of other elements of an employee’s total compensation package.
- #LI-Onsite