About the role
What We're Looking For
- We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
- This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background
- Experience with integrated photonics package assemblies with multiple dies
- Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
- Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have
- Experience with large device count photonic assemblies
- Experience with clear underfill
- Experience with high density fiber attach
- Experience with large substrate size photonic MCM assemblies
- Hands-on experience with PIC design